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Wafer To board wafer 0.8mm SMT Single Row

432A

Wafer To board wafer 0.8mm SMT Single Row

Specifications

  • Current Rating: 0.5A AC/DC
  • Voltage Rating: 30V AC/DC
  • Contact Resistance: 20mΩ Max.
  • Insulation Resistance: 100MΩ Min.
  • Withstand Voltage: AC200V/Minute
  • Operating Temperature: -25℃ ~ +85℃
     

Material

  • Housing: Thermoplastic UL94V-0
  • Contact Pin: Copper Alloy T=0.15
  • Tab: Copper Alloy T=0.2
     

Finishes

  • Housing: LCP UL94V-0 Natural
  • Contact Pin: Gold Plated
  • Tab: Gold Plated
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